More than a supplier: liquid cooling expertise for scaling data centers

With decades of experience in fluid engineering and product development, CEJN’s specialists contribute critical knowledge that supports both new OCP solutions and the company’s own product development initiatives – aligned with the technical demands of scaling data center infrastructure.

Being a supplier is one thing – being a partner is another. Today’s technology landscape demands more than simple product delivery. It requires an understanding of the full value chain – and the technical depth needed to move an industry forward. Our work extends far beyond components, grounded in engineering expertise that helps shape global Open Compute Project (OCP) standards and drives the advancement of our own innovations for next‑generation cooling technologies.

Working alongside the OCP ecosystem

Working directly with Cloud Service Providers (CSPs), integrators, and hardware manufacturers, CEJN brings deep engineering insight while supporting the open and transparent development model that defines OCP.

“OCP moves quickly, and solutions must be both technically robust and easy to scale. Our role is to ensure every new connector standard is grounded in proven engineering, testing, and end‑user needs,” says Mats Ahnheim, Product Manager DC‑Tech at CEJN.

“Beyond this, we contribute to the development of new test methodologies that validate connector performance, leakage and pressure cycles, seal and redundancy criteria, mechanical durability, and interoperability – ensuring new OCP products are tested with real‑world operational conditions in mind,” he continues.

With an already wide OCP product portfolio covering UQD, UQDB, LQC, BMQC and PBMC, more solutions are soon to be released, including:

• UQD and UQDB V2 – upgraded versions with refinements and advanced interoperability testing. Once released, UQDB (Universal Quick Disconnect Blind Mate) will be merged into the UQD (Universal Quick Disconnect) standard.
• Hyperscale quick connect coupling – a commonly used CSP quick‑connect coupling with profile NSP06 for liquid cooling server loop connections.

From the left: LQC, UQDB, BMQC, UQD and PBMC.

To meet the growing demand for OCP coupling solutions, CEJN are expanding existing production facilities by adding an additional site in Asia to support regional market requirements.

Innovation beyond standards

While contributing extensively to industry standards, CEJN continues to invest heavily in its own research and innovation – anticipating the demands of the next wave of cooling technologies.

One such example is 2‑phase cooling, which becomes essential as single‑phase cooling approaches its limits. “Indications show that single‑phase cooling is nearing its technical reach. Because of this, we are developing a variant of our ultraFLOW quick connect couplings specifically suited for 2‑phase cooling infrastructures, including multiple refrigerant types,” Ahnheim explains.

The product range has also expanded with thermal hoses specifically designed for data center applications, including Coolant Distribution Units (CDUs) and Direct Liquid Cooling (DLC) circuits for server racks.

“Customers want reliability, speed, and simplicity. With tested hose and coupling systems built to work seamlessly together, we cut down on variables, reduce risk, and ensure solid, reliable performance.”

The data center product range is expanding with thermal management hoses. The ultraFLOW 2‑phase cooling coupling will be available in 2026.

 

This is Mats Ahnheim 

Product Manager DC-Tech at CEJN

With more than 30 years at CEJN – spanning design engineering, R&D, and product management across fluids, breathing air, multi‑couplings, and now data center cooling – he brings a depth of experience that few in the industry can match. Having followed the development of liquid cooling for decades and understanding how technical requirements are shifting, he continues to investigate new technologies and their potential impact on future cooling architectures.