SC26 (Supercomputing)

As AI workloads continue to drive unprecedented compute density, liquid cooling has become essential for delivering the performance, efficiency, and sustainability required by today's HPC and AI systems. CEJN is at the forefront of this evolution, providing reliable, high-performance thermal management solutions that help data centers maximize uptime, simplify maintenance, and support scalable liquid cooling deployments.

Visit the CEJN booth to explore our latest thermal management technologies, including:

• OCP Series quick connect couplings engineered to meet Open Compute Project standards for interoperability, reliability, and high-performance liquid cooling.
• Dripless quick connect couplings that minimize fluid loss and air inclusion during connection and disconnection, helping protect valuable computing equipment.
• High-flow thermal management hoses designed for demanding AI and HPC cooling applications, delivering superior flow performance and long service life.
• Blind-mate and modular connection solutions that simplify installation and accelerate maintenance in dense server and rack environments.
• Engineered connection solutions that improve reliability, reduce service time, and support the next generation of AI factories and high-performance computing infrastructure.

As an active contributor to the Open Compute Project (OCP), CEJN collaborates with industry leaders to help develop open liquid cooling standards that enable interoperable, future-ready data center solutions. Our OCP Series products support the evolving needs of hyperscale, enterprise, and HPC environments where reliability and serviceability are critical.

Whether you're designing next-generation AI clusters, expanding HPC capacity, or implementing liquid cooling for the first time, stop by the CEJN booth to meet our experts and discover how CEJN's innovative connection technology can help optimize your thermal management system.

We look forward to connecting with the HPC community in Chicago at SC26.