2026 OCP Global Summit

As liquid cooling becomes essential for high-density AI and HPC environments, CEJN continues to drive innovation in reliable, high-performance fluid connection technology. Visit our booth to discover how our thermal management solutions maximize uptime, simplify maintenance, and improve cooling efficiency for today's most demanding computing applications.

Explore CEJN's latest liquid cooling solutions, including:

• OCP Series quick connect couplings, developed to meet Open Compute Project standards for interoperability and reliable liquid cooling performance, including UQD, LQC, UQDB, and PBMC solutions.
• Dripless quick connect couplings that minimize fluid loss and air inclusion during connection and disconnection.
• High-flow thermal management hoses engineered for reliable performance, kink resistance, and safe operation in demanding AI data center environments.
• Blind-mate and modular connection solutions that enable faster installation and easier servicing of dense server racks.
• Engineered connection solutions that improve reliability, reduce maintenance time, and support scalable AI infrastructure.

CEJN is proud to be an active contributor to the Open Compute Project (OCP) community, collaborating with leading cloud service providers, system integrators, and equipment manufacturers to help develop the next generation of open liquid cooling standards. As one of the key contributors to OCP quick connect coupling development—including UQD, LQC, UQDB, and the new Pivoting Blind Mate Coupling (PBMC) standard—CEJN is helping create interoperable, future-ready cooling solutions for AI and hyperscale data centers.

Whether you're designing next-generation AI infrastructure or optimizing existing liquid cooling systems, stop by the CEJN booth to meet our experts and learn how CEJN's innovative OCP Series connection solutions are helping shape the future of sustainable, high-performance computing.

We look forward to seeing you in San Jose!